New centre will support UK and international customers with lab-to-scale packaging of semiconductor components.

The RA8P1 is intended for edge and endpoint AI applications, using the Ethos-U55 NPU to offload the CPU for compute intensive ...

Infineon Technologies has announced that its scalable GaN manufacturing on 300-millimeter wafers roadmap is on track.

Taoglas, a provider of advanced RF and antenna solutions, has released the Patriot series, a multi-function antenna.

Nexperia designs diodes to protect 48V automotive data communications networks against the destructive effects of ESD.

R&S acquires ZES ZIMMER Electronic Systems, a company specialising in high-precision power measurement technology.

Ampleon, a chip manufacturer specialising in radio frequency technology, signs distribution agreement with Mouser.

Is Intel planning to move away from its 18A node in favour of its next generation 14A process for new foundry customers?

The human body is made up of all sorts of shapes and sizes of bones, ligaments, muscles, organs and tissue, almost none of which are flat. Yet most X-ray scanners are flat and rigid. But that is all ...

Navitas Semiconductor, a leading developer of next-generation GaNFast gallium nitride (GaN) and GeneSiC silicon carbide (SiC) ...

Global front-end semiconductor suppliers are accelerating expansion efforts to support demand for generative AI.

The TinyML Foundation’s work, along with that of Silicon Labs, helps users explore new use-cases and challenges that embedded ...